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International Semiconductor Executive Summit Webinar - Advanced Packaging Task Force II
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With electronics products makers calling on semiconductors to support more high-performance applications in smaller footprints, packaging is rising in importance as a key enabling technology. Increasing packaging miniaturization and integration are providing benefits for electronics systems including:
- More functionality in less space
- Higher performance
- Smaller size
- Lower cost
The next generation of packaging advances will require collaboration across the semiconductor supply chain with new ideas, partnerships and new business models.

Samsung Electronics - Dae-Woo Kim, Corporate Vice President, Head of Advanced Package Development Team
Topic: Advanced Package Trends

Amkor Technology, Inc. - Ron Huemoeller, Corporate Vice President,
Head of Global R&D and Technology Strategy
Topic: Heterogeneous Integration: A New Era of Advanced Package Technology
Abstract: The pace of technical innovation in semiconductor packaging continues to accelerate forward at remarkable rates. While the latest wave of technology advancements is largely due to product needs in artificial intelligence (AI), deep learning and cloud computing, the mobile market continues to have strong influence as well. For each of these leading-edge applications, the technology drivers all share a common feature: ultra-high-speed computing integration. As a result of recent advancements in packaging technology, specifically heterogeneous integration, the integration of higher bandwidth memory (HBM), higher transmission speeds and high-performance computing can all be addressed. Technologies such as High-Density Fan-Out (HDFO), 2.5D Through Silicon Via (TSV), silicon bridge and chip on substrate (CoS) will all play key roles in addressing these end product markets. In addition, as the semiconductor industry approaches the fundamental limits of silicon......

Aug 4, 2020 10:00 PM in Beijing, Shanghai

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