This is a broadcast of the live event held on November 9, 2020. Recordings are available to registered attendees of 3D CIC (3dcic.com).
How do the standards support 3D CAD interoperability, and what are their future plans for continued growth? What challenges do they face on their journey?
Expert representatives from ASME, DMSC, SAE, DEDMWG, ISO TC 184, and MTConnect standards organizations will participate in a roundtable discussion of interoperability and the ways in which they’re looking to the future.
Learn more: https://www.action-engineering.com/3d-cic/home-edition#november9