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Topic
Root Cause Workshop - Stencil Design for SMT Component Thermal Lands
Date & Time

Selected Sessions:

Oct 20, 2020 06:00 PM

Description
This paper specifically explores the effect of the window pane design on void area percentage after reflow for surface mount technology (SMT) component thermal pads without introducing float to the component. FREE Webinar Series - Quarantech Tuesdays Join SMT Experts every other week as we discuss common assembly defects, yield issues, and simple solutions to enhance every assembly process.