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Topic
How to Fill the Void - Mitigation of Voiding For Bottom Terminated Components
Date & Time

Selected Sessions:

Oct 6, 2020 06:00 PM

Description
Voiding in solder joints is a complex issue that often requires multiple approaches to reduce voiding below required limits. This webinar focuses on solutions to voiding for commonly used bottom terminated components (BTCs). FREE Webinar Series - Quarantech Tuesdays Join SMT Experts every other week as we discuss common assembly defects, yield issues, and simple solutions to enhance every assembly process.