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Quarantech Tuesdays - Free Technical Webinar Series
How to Fill the Void - Mitigation of Voiding For Bottom Terminated Components

00:41:00

Oct 6, 2020 11:46 AM

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Speakers

Greg Smith
MANAGER OF STENCIL TECHNOLOGY @BlueRing Stencils
Greg Smith has worked in the electronics assembly industry since 1989. He was the owner and President of a stencil manufacturing company for 23 years prior to joining FineLine Stencil (FLS). Since the merger of FLS and MET, Greg has been utilizing his decades of experience to help customers with stencil design and manages BlueRing Stencils Root Cause Analysis services which assists customers in identifying yield problems. As the Manager of Stencil Technology and author of various industry research papers, Greg’s knowledge and expertise is vital to the success of BlueRing Stencils.
Tony Lentz
Field Application Engineer @FCT Solder
Tony Lentz has worked in the electronics industry since 1994. He worked as a process engineer at a circuit board manufacturer for 5 years. Over the last 14 years, Tony has worked for FCT as a chemical laboratory manager and facility manager. Tony has extensive experience doing research and development, quality control, and technical service with products used to manufacture and assemble printed circuit boards. Tony has been involved with APEX for many years. He holds B.S. and M.B.S. degrees in Chemistry.