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Printing of solder paste and stencil technology has been well studied and many papers have been presented on the topic. Very few studies have looked at how solder paste volume affects solder joint reliability. It is the aim of this work to correlate printed solder paste volume to solder joint reliability. FREE Webinar Series - Quarantech Tuesdays Join SMT Experts every other week as we discuss common assembly defects, yield issues, and simple solutions to enhance every assembly process.