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The fundamentals of solder paste technology
Solder is a critical interconnection material in the electronics manufacturing process. This panel will seek to provide a fundamental guide to all the characteristics that continue to make solder the interconnection of choice for todays PCB assemblies. This will include paste types, powder sizes, the role of flux chemistries, temperature and much more.

After the panel has been broadcast, it will be available within 24 hours at

Oct 26, 2021 03:30 PM in London

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