High frequency printed circuit boards are designed in a wide variety of stack ups to achieve proper electrical performance and to meet end use requirements. A final stack up is a composite of laminates and bonding materials. The focus of this presentation will be on the adhesive and bonding material options for high frequency printed circuit designs. We will examine the electrical, mechanical, and thermal performance parameters which all need to be factored into final adhesive choice. We will also examine how printed circuit board fabrication and assembly can influence adhesive choice. A variety of high frequency adhesive options will be discussed including industry standards and state of the art offerings from Rogers.