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Next Generation Line/Space Capability for PCB Designs (Part 1)
The Future is here!

New A-SAP Process: The key to handling cutting edge PCB requirements for products of the future

ASC has licensed the Averatek’s A-SAP™ (Semi-Additive PCB Process). This process enables feature sizes of 25 micron and below, opening new possibilities and options for PCB designers to solve complex design issues. This session will provide an overview of the A-SAP™ process and explore Space, Weight and Packaging benefits including:

• Reduced circuit size
• Reduced layer count
• Reduced lamination cycles
• Reduced microvia layers
• Increased electronics functionality within existing footprint

Presenters: Mike Vinson, John Bushie, Anaya Vardya


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