webinar register page

Webinar banner
Assembly and Packaging of Photonic Integrated Circuits: A Modular Concept Towards a Fully Automated Process


Jun 9, 2020 04:28 PM

Webinar logo
* Required information


Scott Jordan
Head of the photonics market segment @Physik Instrumente
Scott Jordan is Head of Photonics for PI and a PI Fellow. A physicist, with an MBA in Finance/New Ventures, he has multiple contributions to positioning and optimization technologies.
Sander Dorrestein
Senior micro optics and electronics assembly engineer @CITC
Sander Dorrestein, senior micro optics and electronics assembly engineer at CITC. During his career he has held multiple positions at high tech companies such as Philips, Amada, TE Connectivity, TEGEMA and CITC where he continuously develops micro assembly processes in the field of microelectronics and micro optics. His passion for micro assembly technologies yielded to several innovative processes which are currently running in mass production environment. He has contributed to several academic papers and holds multiple patents on assembly technologies.
Arno Thoer
Project Solutions Director @Tegema
Arno Thoer is Project solutions director at Tegema. He is an experienced technical professional working 15+ years in the machine building industry. His experience is in specifying and designing complex automated machines, where product-handling is essential combined with several different micro joining solutions like dispensing, laser welding & marking, resistance welding and hot bar technology.