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Next Generation Line/Space Capability for PCB Designs (Part 2)
Industry Experts Discuss New Cutting-Edge technology. This will take your PCBs to the next level!

Beginning with a recap of the Averatek A-SAP(TM) process, this session will explore:
• Signal Integrity Benefits: (high aspect ratio traces, tighter impedance control, etc.)
• Materials Characterization results: (range of standard, high performance and flex materials)
• Reliability Test Results: D-Coupon/ IST
• Ability to form conductors with Gold rather than Copper conductors

Presenters: Haris Basit, John Bushie, Anaya Vardya


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