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ISES Webinar - Advanced Packaging The Titans
This is a MEMBERS Only Event.

To Register as member please visit: www.isesglobal.com

Confirmed Speakers:

Babak Sabi, Corporate VP, GM Assembly and Test Technology Development - Intel

Topic: Advanced Packaging Architectures: Opportunities and Challenges

Marvin Liao, VP Advanced Packaging and Technology Services - TSMC

Topic : 3DFabricTM for System Level Innovation

Seungwook Yoon, Corporate VP/Head of Team of Package Technology Strategy and Planning, - Samsung Electronics

Topic: Heterogeneous Integration : Chiplet packaging technology for Next Gen. Devices

Agenda in Pacific Time (US and Canada)
07:00 am- 10:00 am

Thank you to our Sponsors:
Amkor Technology | Applied Materials | ASM PT | Aveni | BASF | Beneq | BESI | Brewer Science | Evatec | DAS | HDL Design House | EVG | FormFactor | International Test Solutions | JSR Micro | KLA | Lam Research | Lizhu Semiconductors | LPKF Lasers & Electronics | ON Semiconductor | Onto Innovation | PDF Solutions | Pfeiffer Vacuum | Scientech | Shinhao Materials | Smiths Interconnect | SPEA | Thermofischer Scientific | Trumpf

If you are not a member, please register via www.isesglobal.com

May 6, 2021 07:00 AM in Pacific Time (US and Canada)

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Webinar is over, you cannot register now. If you have any questions, please contact Webinar host: Cindy Chan.